Bootcamp
48 Seats Available
High-Speed Multilayer PCB Design with KiCad 8
Date & Time
Thursday, October 15, 2026 at 09:30 AM
Venue
AAU CTBE Innovation & Hardware Center — Auditorium B
Lab Capacity
50 Participants
Session Overview & Curriculum
Moving beyond breadboards to production-grade hardware.
This bootcamp is engineered for electrical, computer, and electromechanical engineering students wishing to translate breadboard prototypes into compact 4-layer PCBs.
Key topics covered:
1. Schematic capture and library symbol construction according to IEEE standards.
2. Stackup definition and microstrip impedance calculation for USB 2.0 differential pairs.
3. Return path continuity, ground plane stitching, and decoupling capacitor placement.
4. Generating Gerber and drill files alongside bill-of-materials (BOM) for fabrication.
All participants will complete and route their own ESP32-S3 sensor breakout board.
Session Repository & Slide Archive
Access code repositories, schematic diagrams, and presentation materials for this workshop.
Lab Seat Reservation
Seated registration for CTBE students. Confirmation is guaranteed upon submission.
Remaining Capacity:
48 / 50 Seats